Tektronix Prism 3001 Analyzer
Производитель:
Модель:
Prism 3001
Дата:
1994
Категория:
Группа:
Описание:
TestLab Mainframe

Информация

PRODUCT DESCRIPTIONS The basis of the product is a single-host MPU board and an application module board. In addition, the mainframe contains a Power supply, a floppy disk drive, a hard disk drive, a hex keypad (or optional keyboard), and a monochrome CRT monitor. With specially-designed system and application Software, the result is a custom electronic measurement system tailored to a specific application.

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Обслуживание и Руководство пользователя
Hасто́льная кни́га тип:
Обслуживание и Руководство пользователя
Страницы:
188
Размер:
5.96 Mbytes (6252209 Bytes)
Язык:
english
Пересмотр:
Hасто́льная кни́га ID:
070-6676-01
Дата:
01 Январь 1994
Качество:
Отсканированы документу, все читается.
Дата загрузки:
14 Сентябрь 2019
MD5:
e395f2f416d4d38d56d322cd76b3e94c
Загрузки:
361

Информация

ABOUT THIS MANUAL This manual contains service information for the Tektronix Prism 3001 Series and 2505 TestLab electronic measurement and analysis mainframes; hereafter referred to as mainframe. The information in this manual explains how to verify, service, troubleshoot, and repair the mainframe and its internal components. Service information for the MPU board and application modules is provided in separate manuals. This manual contains the following information: Section 1, General Information, briefly describes related manuals, the mainframe (and related components), and service strategy. Section 2, Specifications, describes functional characteristics and performance requirements of the mainframe and associated modules. Section 3, Connectors and Cabling, provides text and illustrations that describe electrical connections between internal electrical modules and chassis-mounted electrical components. Also explains where additional connector and cabling information is located in this manual. Section 4, Theory of Operation, provides descriptions of mainframe modules. General and detailed descriptions of circuitry are provided. If a board is not repaired at the user site, use the general description. If component-level repair is supported, use the detailed descriptions. Section 5, Verification and Adjustments, describes how to verify the functional performance of the mainframe and how to perform adjustments. Section 6, Disassembly I Installation, describes how to remove and replace mainframe modules. Section 7, Maintenance, describes how to perform maintenance on the mainframe. Section 8, Troubleshooting, describes general troubleshooting procedures for mainframe modules. Section 9, Electrical Parts List, lists all the replaceable electrical parts associated with the mainframe. Parts for modules supported with separate service manuals are not included. Section 10, Diagrams, contains block diagrams, interconnect wiring/signal diagrams, and schematics for the mainframe and selected modules. Section 11, Mechanical Parts List, lists the replaceable mechanical parts for the mainframe.

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