Keithley 7174A Вставной
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Модель:
7174A
Дата:
1998
Категория:
Группа:
Описание:
8×12 Low Current Matrix Card
Информация
Features
Key features of the Model 7174A Low Current Matrix Card
include:
• Eight row by twelve column (8×12) switching matrix
configuration, with signal and guard switched at each
crosspoint
• Paths have offset currents of less than 100fA with typical
offset currents of 50fA
• Maximum Leakage Currents:
Pin to Ground -- 0.01 pA/V
Pin to Pin -- 0.005 pA/V
• 3-lug Triaxial Connectors (Signal, Guard, Chassis) for
all row and columns allow guarding of each signal path-
way, minimizing effects of stray capacitance, leakage
current, and leakage resistance
• Model 7174A cards can be connected together internally
using the supplied SMB to SMB cables (jumpers)
to expand the number of columns in the matrix.
Hасто́льная кни́га тип:
Обслуживание и Руководство пользователя
Страницы:
77
Размер:
2.06 Mbytes (2155520 Bytes)
Язык:
english
Пересмотр:
A
Hасто́льная кни́га ID:
7174A-901-01
Дата:
1998 09 01
Качество:
Электронный документ, ни сканирование, очень хорошо читается.
Дата загрузки:
2018 08 23
MD5:
1dfd31a767ba2ee15364f3306a04c2de
Загрузки:
643
Информация
General Information
Introduction
...
1-1
Features
...
1-1
Warranty information
... 1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.7.1
1.7.2
1.7.3
1.8
1.9
2
2.1
2.2
2.3
2.4
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
2.6
2.6.1
2.6.2
2.6.3
2.7
2.7.1
2.7.2
2.7.3
2.7.4
2.7.5
2.7.6
2.7.7
2.7.8
2.8
General Information
Introduction
...
1-1
Features
...
1-1
Warranty information
...
1-1
Manual addenda
...
1-2
Safety symbols and terms
...
1-2
Specifications
...
1-2
Unpacking and inspection
...
1-2
Inspection for damage
...
1-2
Shipment contents
...
1-2
Instruction manual
...
1-2
Packing for shipment
...
1-2
Optional Accessories
...
1-2
Operation
Introduction
...
2-1
Handling precautions
...
2-1
Environmental considerations
...
2-1
Card installation and removal
...
2-2
Connections
...
2-2
Card connectors
...
2-2
Recommended cables and adapters
...
2-3
Triax banana plug adapter
...
2-4
General instrument connections
...
2-5
Keithley instrument connections
...
2-11
Typical test fixture connections
...
2-17
Matrix configuration
...
2-18
Switching matrix
...
2-18
Path isolators
...
2-18
Internal matrix expansion
...
2-21
Measurement considerations
...
2-22
Magnetic fields
...
2-22
Electromagnetic Interference (EMI)
...
2-22
Ground loops
...
2-22
Keeping connectors clean
...
2-23
Noise currents caused by cable flexing
...
2-23
Shielding
...
2-23
Guarding
...
2-24
Matrix expansion effects on card specifications
...
2-24
Coaxial jumper access
...
2-25
...
1-1
Manual addenda
...
1-2
Safety symbols and terms
...
1-2
Specifications
...
1-2
Unpacking and inspection
...
1-2
Inspection for damage
...
1-2
Shipment contents
...
1-2
Instruction manual
...
1-2
Packing for shipment
...
1-2
Optional Accessories
...
1-2
Operation
Introduction
...
2-1
Handling precautions
...
2-1
Environmental considerations
...
2-1
Card installation and removal
...
2-2
Connections
...
2-2
Card connectors
...
2-2
Recommended cables and adapters
...
2-3
Triax banana plug adapter
...
2-4
General instrument connections
...
2-5
Keithley instrument connections
...
2-11
Typical test fixture connections
...
2-17
Matrix configuration
...
2-18
Switching matrix
...
2-18
Path isolators
...
2-18
Internal matrix expansion
...
2-21
Measurement considerations
...
2-22
Magnetic fields
...
2-22
Electromagnetic Interference (EMI)
...
2-22
Ground loops
...
2-22
Keeping connectors clean
...
2-23
Noise currents caused by cable flexing
...
2-23
Shielding
...
2-23
Guarding
...
2-24
Matrix expansion effects on card specifications
...
2-24
Coaxial jumper access
...
2-25
Applications
Introduction
...
3-1
CV measurements
...
3-1
Stand alone system configuration
...
3-1
Computerized system configuration
...
3-1
Optimizing CV measurement accuracy
...
3-3
Basic CV test procedure
...
3-3
Typical CV curves
...
3-3
Semiconductor test matrix
...
3-5
System configuration
...
3-5
Testing common-source characteristic of FETs
...
3-6
Resistivity measurements
...
3-7
Test configuration
...
3-7
Test procedure
...
3-7
Resistivity calculations
...
3-9
Semiconductor IV characterization
...
3-9
Test configuration
...
3-9
Cable connections
...
3-10
Service Information
Introduction
...
4-1
Handling and cleaning precautions
...
4-1
Principles of operation
...
4-2
Block diagram
...
4-2
ID data circuits
...
4-2
Relay control
...
4-3
Power-on sequence
...
4-3
Isolator relays
...
4-4
Troubleshooting
...
4-4
Recommended equipment
...
4-4
Gaining circuit access
...
4-4
Troubleshooting procedure
...
4-4
Special handling of static-sensitive devices
...
4-5
Performance verification
...
4-5
Environment conditions
...
4-5
Recommended test equipment
...
4-5
Offset current verification
...
4-6
Path isolation verification
...
4-7
Path resistance verification
...
4-9
Reed pack
replacement ...
4-11
Replaceable Parts
Introduction
...
5-1
Parts list
...
5-1
Ordering information
...
5-1
Factory service
...
5-1
Component layout and schematic diagram
...
5-1