Keithley 7174A Вставной
Производитель:
Модель:
7174A
Дата:
1998
Категория:
Группа:
Описание:
8×12 Low Current Matrix Card

Информация

Features Key features of the Model 7174A Low Current Matrix Card include: • Eight row by twelve column (8×12) switching matrix configuration, with signal and guard switched at each crosspoint • Paths have offset currents of less than 100fA with typical offset currents of 50fA • Maximum Leakage Currents: Pin to Ground -- 0.01 pA/V Pin to Pin -- 0.005 pA/V • 3-lug Triaxial Connectors (Signal, Guard, Chassis) for all row and columns allow guarding of each signal path- way, minimizing effects of stray capacitance, leakage current, and leakage resistance • Model 7174A cards can be connected together internally using the supplied SMB to SMB cables (jumpers) to expand the number of columns in the matrix.

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Обслуживание и Руководство пользователя
Hасто́льная кни́га тип:
Обслуживание и Руководство пользователя
Страницы:
77
Размер:
2.06 Mbytes (2155520 Bytes)
Язык:
english
Пересмотр:
A
Hасто́льная кни́га ID:
7174A-901-01
Дата:
1998 09 01
Качество:
Электронный документ, ни сканирование, очень хорошо читается.
Дата загрузки:
2018 08 23
MD5:
1dfd31a767ba2ee15364f3306a04c2de
Загрузки:
643

Информация

General Information Introduction ... 1-1 Features ... 1-1 Warranty information ... 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.7.1 1.7.2 1.7.3 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.5.1 2.5.2 2.5.3 2.5.4 2.5.5 2.5.6 2.6 2.6.1 2.6.2 2.6.3 2.7 2.7.1 2.7.2 2.7.3 2.7.4 2.7.5 2.7.6 2.7.7 2.7.8 2.8 General Information Introduction ... 1-1 Features ... 1-1 Warranty information ... 1-1 Manual addenda ... 1-2 Safety symbols and terms ... 1-2 Specifications ... 1-2 Unpacking and inspection ... 1-2 Inspection for damage ... 1-2 Shipment contents ... 1-2 Instruction manual ... 1-2 Packing for shipment ... 1-2 Optional Accessories ... 1-2 Operation Introduction ... 2-1 Handling precautions ... 2-1 Environmental considerations ... 2-1 Card installation and removal ... 2-2 Connections ... 2-2 Card connectors ... 2-2 Recommended cables and adapters ... 2-3 Triax banana plug adapter ... 2-4 General instrument connections ... 2-5 Keithley instrument connections ... 2-11 Typical test fixture connections ... 2-17 Matrix configuration ... 2-18 Switching matrix ... 2-18 Path isolators ... 2-18 Internal matrix expansion ... 2-21 Measurement considerations ... 2-22 Magnetic fields ... 2-22 Electromagnetic Interference (EMI) ... 2-22 Ground loops ... 2-22 Keeping connectors clean ... 2-23 Noise currents caused by cable flexing ... 2-23 Shielding ... 2-23 Guarding ... 2-24 Matrix expansion effects on card specifications ... 2-24 Coaxial jumper access ... 2-25 ... 1-1 Manual addenda ... 1-2 Safety symbols and terms ... 1-2 Specifications ... 1-2 Unpacking and inspection ... 1-2 Inspection for damage ... 1-2 Shipment contents ... 1-2 Instruction manual ... 1-2 Packing for shipment ... 1-2 Optional Accessories ... 1-2 Operation Introduction ... 2-1 Handling precautions ... 2-1 Environmental considerations ... 2-1 Card installation and removal ... 2-2 Connections ... 2-2 Card connectors ... 2-2 Recommended cables and adapters ... 2-3 Triax banana plug adapter ... 2-4 General instrument connections ... 2-5 Keithley instrument connections ... 2-11 Typical test fixture connections ... 2-17 Matrix configuration ... 2-18 Switching matrix ... 2-18 Path isolators ... 2-18 Internal matrix expansion ... 2-21 Measurement considerations ... 2-22 Magnetic fields ... 2-22 Electromagnetic Interference (EMI) ... 2-22 Ground loops ... 2-22 Keeping connectors clean ... 2-23 Noise currents caused by cable flexing ... 2-23 Shielding ... 2-23 Guarding ... 2-24 Matrix expansion effects on card specifications ... 2-24 Coaxial jumper access ... 2-25 Applications Introduction ... 3-1 CV measurements ... 3-1 Stand alone system configuration ... 3-1 Computerized system configuration ... 3-1 Optimizing CV measurement accuracy ... 3-3 Basic CV test procedure ... 3-3 Typical CV curves ... 3-3 Semiconductor test matrix ... 3-5 System configuration ... 3-5 Testing common-source characteristic of FETs ... 3-6 Resistivity measurements ... 3-7 Test configuration ... 3-7 Test procedure ... 3-7 Resistivity calculations ... 3-9 Semiconductor IV characterization ... 3-9 Test configuration ... 3-9 Cable connections ... 3-10 Service Information Introduction ... 4-1 Handling and cleaning precautions ... 4-1 Principles of operation ... 4-2 Block diagram ... 4-2 ID data circuits ... 4-2 Relay control ... 4-3 Power-on sequence ... 4-3 Isolator relays ... 4-4 Troubleshooting ... 4-4 Recommended equipment ... 4-4 Gaining circuit access ... 4-4 Troubleshooting procedure ... 4-4 Special handling of static-sensitive devices ... 4-5 Performance verification ... 4-5 Environment conditions ... 4-5 Recommended test equipment ... 4-5 Offset current verification ... 4-6 Path isolation verification ... 4-7 Path resistance verification ... 4-9 Reed pack replacement ... 4-11 Replaceable Parts Introduction ... 5-1 Parts list ... 5-1 Ordering information ... 5-1 Factory service ... 5-1 Component layout and schematic diagram ... 5-1

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