Keithley 7071 Insertion
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Modèle:
7071
Date:
1991
Catégorie:
Groupe:
Description:
General Purpose Matrix Card
Information
The Model 7071 is a general purpose, three-pole 8 x 12 (8
row by 12 column) matrix card. Some of the key features include:
• Guard capability. Each HI/LO path pair on the PC board is
surrounded by a third path that can be used for guarding.
• Low contact potential and offset current for minimal
effects on low-level signals.
• Quick disconnects using the "rack and panel" receptacles
on the rear panel or terminal blocks on the PC board.
Type manuel:
Service et Manuel de l'utilisateur
Pages:
79
Taille:
2.94 Mbytes (3081946 Bytes)
Langue:
english
Révision:
D
Manuel-ID:
7071-901-01
Date:
1991 06 01
Qualité:
Document scanné, tous les lisible.
Date de transfert:
2018 08 25
MD5:
9c3471e1b79186c3d4b73b039157c8ef
Téléchargements:
452
Information
1.1 INTRODUCTION
...
1-1
1.2 FEATURES
...
1-1
1.3 WARRANTY INFORMATION
...
1-1
1.4 MANUAL
ADDENDA ...
1-1
1.5 SAFETY SYMBOLS AND TERMS
...
1-1
1.6 SPECIFICATION
S ...
1-1
1.7 UNPACKING and
INSPECTION ...
1-1
1.7.1 Inspection for
Damage ...
1-1
1.7.2 Shipping Contents
...
1-2
1.7.3 Instruction
Manual ...
1-2
1.8 REPACKING FOR
SHIPMENT ...
1-2
1.9 OPTIONAL
ACCESSORIES ...
1-2
SECTION 2—Operation
2.1
INTRODUCTION ...
2-1
2.2 HANDLING PRECAUTIONS
...
2-1
2.3 CARD INSTALLATION AND
REMOVAL ...
2-1
2.4 BASIC MATRIX
CONFIGURATIONS ...
2-2
2.4.1 Single-Ended Switching
...
2-6
2.4.2 Differential
Switching ...
2-6
2.4.3
Guarding ...
2-6
2.4.4
Sensing ...
2-6
2.5 CONNECTION
METHODS ...
2-8
2.5.1 Connection Methods Using Mass Terminated Cable (Model
7078-MTC) ... 2-9
2.5.2 Direct Connection Method
...
2-15
2.5.3 Connection Method Using Connector Kit {Model 7078-KIT)
... 2-15
2.6 MATRIX
EXPANSION ...
2-18
2.6.1 Narrow Matrix
Expansion ...
2-18
2.6.2 Wide Matrix
Expansion ...
2-19
2.6.3 Partial Matrix
Implementation ...
2-20
2.6.4 Mainframe Matrix
Expansion ...
2-20
2.7 TYPICAL CONNECTION
SCHEMES ...
2-21
2.7.1 Single Card
System ...
2-21
2.7.2 Multiple Card
System ...
2-22
2.7.3 Multiple Mainframe
System ...
2-22
SECTION 3—Applications
3.1
INTRODUCTION ...
3-1
3.2 THICK FILM RESISTOR NETWORK
TESTING ... 3-1
3.2.1 Four-terminal Ohms
Measurements ...
3-2
3.2.2 Voltage Divider
Checks ...
3-3
3.2.3 Current Shunt
Checks ...
3-5
3.3 TRANSISTOR
TESTING ...
3-5
3.3.1 Current Gain
Checks ...
3-7
4.1
INTRODUCTION ...
4-1
4.2 HANDLING AND CLEANING
PRECAUTIONS ... 4-1
4.3 RELAY TEST PROGRAM
SETUP ...
4-1
4.4 PERFORMANCE VERIFICATION
...
4-2
4.4.1 Environmental Conditions
...
4-3
4.4.2 Recommended
Equipment ...
4-3
4.4.3 Path Resistance
Tests ...
4-3
4.4.4 Offset Current
Tests ...
4-5
4.4.5 Contact Potential
Tests ...
4-7
4.4.6 Path Isolation Tests
...
4-9
4.4.7 Differential and Common Mode Isolation
Tests ... 4-11
4.5 PRINCIPLES OF
OPERATION ...
4-13
4.5.1 Card
Identification ...
4-13
4.5.2 Switching
Circuitry ...
4-14
4.5.3 Power Up
Safeguard ...
4-14
4.6 SPECIAL HANDLING OF STATIC-SENSITIVE
DEVICES ... 4-14
4.7
TROUBLESHOOTING ...
4-15
4.7.1 Recommended Equipment
...
4*15
4.7.2 Troubleshooting
Procedure ...
4-15
SECTION 5—Replaceable Parts
5.1
INTRODUCTION ...
5-1
5.2 PARTS
LISTS ... ; ...
5-1
5.3 ORDERING
INFORMATION ...
5-1
5.4 FACTORY
SERVICE ...
5-1
5.5 COMPONENT LAYOUT AND SCHEMATIC
DIAGRAM ... 5-1