Equipment information

Sennheiser Electronic EM 3032-V Transmitter
Sennheiser Electronic
Model EM 3032-V
Date 1998
Category Professional music equipment
Group Transmitter
Description Mikroport Receiver
                                    With the EM 3031, EM 3032 and EM 3532 receivers, Sennheiser
offers the professional user high quality RF receivers with
high level of operational reliability and ease of use. The
EM 3031, EM 3032 and EM 3532 receivers together with the
suitable hand-held and pocket transmitters permit wireless
sound transmission with studio quality. Due to further
optimised PLL and microprocessor technology and the
Sennheiser patented HiDynplus noise reduction system, these
transmission systems surpass the signal-to-noise ratio and
dynamic range of modern CD productions. The true diversity
technology of EM 3031, EM 3032 and EM 3532 receivers ensures
interference-free transmission and minimizes drop-outs
during the RF transmission.
Especially for small television studios and theaters, the
simultaneous use of several EM 3031, EM 3032 and EM 3532
receivers is an economical alternative to technically more
sophisticated and therefore more expensive multi-channel

 PLL microprocessor control, programmable
 HiDynplus noise reduction system
 High transmission reliability due to true diversity reception
 Ease of use
 "LOW BATT" indicator for Transmitter battery status (only
with certain transmitters
 19" 1 U housing
 Supply voltage for external antenna boosters

These manuals are available for the above equipment:

Manual Type Service Manual Sennheiser-9794-Manual-Page-1-Picture
Pages 148
Size 5.82 Mbytes (6100704 Bytes)
Language english, german
Date 01 July 1998
Quality Scanned document, all readable.
Upload date
MD5 59ae6157eb5805ba7ae978432c95dbe2
Downloads 310 since 29 October 2017
This service manual contains instructions for troubleshooting
and repairing the EM 3031, EM 3032 and EM 3532 Mikroport
A repair of the EM 3031, EM 3032 and EM 3532 Mikroport
receivers can be carried out by replacing the respective
subassembly or assembly. This form of repair has proved its
worth in practical use, and it restricts the necessary
knowledge to the subassemblies.
With suitable measuring and test equipment, the assembly can
be repared down to the component level. Circuit diagrams,
wiring diagrams and block diagrams are included in the section
- General
Section 1.1 explains the concept of the service manual and
helps the user to become acquainted with the individual
- Operating elements
The operation of the receivers is briefly explained; a thorough
knowledge of the subject area is assumed.
- Technical data
This section lists the technical data of the EM 3031, EM 3032
and EM 3532 Mikroport receivers.
- Measuring and test equipment
Here, all the service tools that are necessary for alignment,
repair or frequency changes are listed.
- System overview
The function of the assemblies within the EM 3031, EM 3032
and EM 3532 Mikroport receivers are described in this section.
- Service instructions
This section describes general testing, testing of the reception
qualities, alignment and troubleshooting, error messages, and
hints for troubleshooting. In addition, measures are described
to locate defective components.
- Changing the receiving frequencies
Here, detailed information is given on programming the receiving
frequencies via the service/programming socket. This section
also describes how to change the receiving frequencies within
the defined switching bandwidth, outside the switching
bandwidth and how to replace the tuner assembly.
- Test and alignment instructions
This section describes the test set-up, the localisation of
assemblies and the test and adjustment instructions (with
oscillograms for signal tracing).
- Schematics
This section contains all wiring diagrams, circuit diagrams and
block diagrams of the assemblies of the EM 3031, EM 3032 and
EM 3532 Mikroport receivers.
- Modifications
Technical modifications affecting the content of this service
manual will be distributed to the users as service information
Some of the printed circuit boards are multi-layer PCBs and can
be irreparably damaged by improper repair or handling.
This service manual is intended for technicians to enable them
to carry out the most important repairs and alignments.
If necessary, the manual can also be given to the customer.
If repair is to be carried out by replacing an entire assembly,
it must be carried out as follows:
- IF assembly, Diversity assembly, HDP assembly, Processor
assembly, Display assembly
If repair is not to be carried out by replacing an entire
assembly, the device must be repaired at the component
level using the service manual.
- Main printed circuit board (PCB)
If repair is to carried out either by replacing an entire
component or by a repair at the component level, this is at
the discretion of the service technician.
- Tuner assembly
Fast service means that all assemblies on the spare parts
list have to be held in stock. They can be ordered from the
Sennheiser Service Department.
1.2.4 SMDs (Surface Mounted Devices)
The PCBs of the EM 3031, EM 3032 and EM 3532 Mikroport
receivers are predominantly populated with surface mounted
devices (SMDs). Any SMD damaged during handling must be
SMDs are directly soldered onto the provided substrate lands.
Their end caps have a solderable coating and are largely
insensitive to heat.
To replace SMDs, the following tools are needed: in addition to
a pair of tweezers and a normal, temperature-controlled
iron (e.g. Weller with a 0.8 mm flat-headed soldering bit PT-H
7 or a 0.8 mm long-headed soldering bit PT-K 7), you should
have a suction device that is absolutely blow-back proof
and1.2 mm unsoldering wire. It is also advisable to use a
The soldering time should be kept as short as possible to
ensure that the conductors are not damaged. Especially when
unsoldering the components, care must be taken that the
solder tracks are not lifted off. After soldering, the contact
surface of the components must be cleaned from solder
residue. To avoid mechanical stress within the components,
solder one side first, then wait until this joint has cooled
before soldering the opposite side.
It is not permissible to reuse components that have previously
been unsoldered, even if the component looks faultless. During
soldering and unsoldering, the component is subject to thermal
stress, so damage cannot be excluded.
SMDs are supplied as spares in packs of 50. Containers used
to stock parts have to be unambignously labelled, as
itotherwise not possible to distinguish the components.

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