1.1 INTRODUCTION ........................................................1-1 1.2 SAFETY PRECAUTIONS..................................................1-1 1.3 CAUTION AND WARNING STATEMENTS....................................1-1 1.4 SYMBOLS .............................................................1-1 2 CHARACTERISTICS 21 2.1 VERTICAL .............................................................2-2 2.1.1 Channels.......................................................2-2 2.1.2 Deflection Modes (Analog Only).....................................2-2 2.1.3 Bandwidth ......................................................2-3 2.1.4 Attenuator ......................................................2-3 2.1.5 Input Characteristics..............................................2-4 2.1.6 Coupling .......................................................2-4 2.1.7 Dynamic Range..................................................2-4 2.1.8 Position Range ..................................................2-4 2.1.9 Trace Separation.................................................2-4 2.1.10 Input Voltage Limits...............................................2-5 2.1.11 Step Response ..................................................2-5 2.1.12 Signal Delay ....................................................2-6 2.1.13 Vertical Accuracies ...............................................2-6 2.2 TIMEBASE.............................................................2-7 2.2.1 Timebase (modes) ...............................................2-7 2.2.2 Timebase Settings (Analog Mode Only)...............................2-7 2.2.3 DTB Delay (Analog Mode Only) .....................................2-7 2.2.4 Timebase Settings (Digital Mode Only)................................2-8 2.2.5 Timebase Delay (Digital Mode Only)..................................2-9 2.2.6 DTB Delay (Digital Mode Only)......................................2-9 2.2.7 Analog Timebase Accuracies.......................................2-9 2.2.8 Delaytime Accuracy (Analog Mode) ..................................2-9 2.2.9 DTB Jitter In Starts (Analog Mode)..................................2-10 2.2.10 Timebase Accuraries (Digital Mode).................................2-10 2.2.11 DTB Jitter In Starts (Digital Mode)...................................2-10 2.2.12 External Horizontal Deflection......................................2-10 2.2.13 Horizontal Display Accuracy.......................................2-10 2.3 TRIGGERING..........................................................2-11 2.3.1 Source........................................................2-11 2.3.2 Modes........................................................2-11 2.3.3 TV Systems....................................................2-11 2.3.4 Coupling ......................................................2-11 2.3.5 Sensitivity .....................................................2-12 2.3.6 Slope.........................................................2-13 2.3.7 Level .........................................................2-13 2.3.8 Logic Triggering Timing (Digital Mode Only)...........................2-14 2.3.9 Trigger Accuracies ..............................................2-14 2.4 EVENT COUNTER......................................................2-15 2.5 HOLD-OFF............................................................2-15 2.6 PROCESSING .........................................................2-16 2.6.1 Preprocessing..................................................2-16 2.6.2 Register Processing (Digital Mode)..................................2-16 2.7 TRACE MEASUREMENTS (DIGITAL MODE).................................2-17 2.8 CURSORS............................................................2-17 2.8.1 Cursor Control..................................................2-17 2.8.2 Cursor Readouts................................................2-18 2.8.3 Cursor Accuracies ( Analog Mode)..................................2-18 2.8.4 Cursor Accuracies (Digital Mode)...................................2-18 2.9 DIGITAL ACQUISITION..................................................2-19 2.9.1 Modes........................................................2-19 2.9.2 Sample Rate...................................................2-19 2.9.3 Multiplexed Channels ............................................2-19 2.9.4 Trace Memory..................................................2-19 2.9.5 Acquisition Time ................................................2-20 2.9.6 Resolution.....................................................2-20 2.9.7 Registers......................................................2-21 2.9.8 Register Manipulations ...........................................2-21 2.9.9 Digital Acquisition Accuracies......................................2-21 2.10 FRONT PANEL MEMORY................................................2-21 2.11 BLANKING OR Z-AXIS (ONLY FOR ANALOG TRACE).........................2-22 2.12 DISPLAY .............................................................2-22 2.12.1 CRT..........................................................2-22 2.12.2 Modes........................................................2-22 2.12.3 Vertical Display Manipulations (Digital Mode)..........................2-23 2.12.4 Horizontal Display Manipulations (Digital Mode)........................2-23 2.13 EXTERNAL INTERFACES................................................2-24 2.13.1 Calibrator......................................................2-24 2.13.2 Standard external interface........................................2-24 2.13.3 Optional external interfaces........................................2-25 2.13.4 Printers and plotters support.......................................2-25 2.13.5 Real Time Clock ................................................2-26 2.14 AUTO SET & CALIBRATION..............................................2-26 2.14.1 Auto Set ......................................................2-26 2.14.2 Calibration.....................................................2-26 2.15 POWER SUPPLY AND BATTERY BACKUP..................................2-26 2.15.1 Power Supply ..................................................2-26 2.15.2 Battery Backup .................................................2-27 2.16 MECHANICAL CHARACTERISTICS........................................2-27 2.17 ENVIRONMENTAL CHARACTERISTICS....................................2-28 2.17.1 General.......................................................2-28 2.17.2 Environmental..................................................2-28 2.17.3 EMI ..........................................................2-29 2.18 SAFETY..............................................................2-30 2.19 ACCESSORIES........................................................2-30 2.20 OPTIONS & OPTIONAL VERSIONS........................................2-30 2.20.1 Options Line cord ...............................................2-30 2.20.2 Options digital versions...........................................2-30 2.20.3 Options analog .................................................2-31 2.20.4 Specification optional outputs......................................2-31 2.20.5 Specification External trigger option .................................2-31 2.20.6 Specification IEEE-OPTION .......................................2-32 2.20.7 Extended memory...............................................2-33 3 DESCRIPTIONS 35 3.1 GENERAL DESCRIPTION.................................................3-5 3.1.1 Introduction to oscilloscope family....................................3-5 3.1.2 Introduction to descriptions.........................................3-5 3.1.3 Explanation of signal names........................................3-6 3.1.4 Voltage values in the circuit diagrams.................................3-6 3.2 BLOCK DIAGRAM DESCRIPTION ..........................................3-7 3.2.1 Introduction.....................................................3-7 3.2.2 Vertical channels.................................................3-8 3.2.3 Triggering and time bases..........................................3-9 3.2.4 Final amplifiers .................................................3-10 3.2.5 Front unit and microprocessor......................................3-11 3.2.6 Power supply...................................................3-11 3.2.7 Digitizer.......................................................3-12 4 PARTS ......................................................................4-1 4.1 UNITS.................................................................4-1 4.2 INTERCONNECTION CABLES.............................................4-2 4.3 MECHANICAL PARTS....................................................4-4 5 UNIT DESCRIPTIONS.................................................... 5.1-1 5.1 SIGNAL UNIT A1 ...................................................... 5.1-1 5.1.1 Description A1................................................. 5.1-1 5.1.2 Signal name list............................................... 5.1-14 5.1.3 Unit lay-outs ................................................. 5.1-21 5.1.4 Location list Signal Unit A1 ...................................... 5.1-25 5.1.5 Circuit diagrams .............................................. 5.1-35 5.1.6 Parts list .................................................... 5.1-61 5.2 FINAL XYZ AMPLIFIER A2 .............................................. 5.2-1 5.2.1 Description of A2-200 MHz version................................. 5.2-1 5.2.2 Signal name list A2-200 MHz version............................... 5.2-5 5.2.3 Unit lay-outs A2-200 MHz version.................................. 5.2-7 5.2.4 Location list A2-200 MHz version .................................. 5.2-9 5.2.5 Circuit diagramsA2-200 MHz version .............................. 5.2-13 5.2.6 Parts list A2-200 MHz version.................................... 5.2-19 5.2.7 Description of A2-100 MHz version................................ 5.2-35 5.2.8 Signal name list A2-100 MHz version.............................. 5.2-39 5.2.9 Unit lay-outs A2-100 MHz version................................. 5.2-41 5.2.10 Location List A2-100 MHz version................................. 5.2-43 5.2.11 Circuit diagrams A2-100 MHz version.............................. 5.2-47 5.2.12 Parts list A2-100 MHz version.................................... 5.2-53 5.3 MICROPROCESSOR A3................................................................................................5.3-1 5.3.1 Description A3..................................................................................................5.3-1 5.3.2 Signal name list A3..........................................................................................5.3-2 5.3.3 Location list......................................................................................................5.3-4 5.3.4 Unit lay-outs ....................................................................................................5.3-5 5.3.5 Circuit diagrams ..............................................................................................5.3-7 5.3.6 Parts list ........................................................................................................5.3-13 5.4 FRONT UNIT A4 ...................................................... 5.4-1 5.4.1 Description ......................................................................................................5.4-1 5.4.2 Signal name list A4..........................................................................................5.4-1 5.4.3 Key switches....................................................................................................5.4-2 5.4.4 Unit lay-outs ....................................................................................................5.4-5 5.4.5 Circuit diagrams ..............................................................................................5.4-7 5.4.6 Parts list ..........................................................................................................5.4-9 5.5 CRT CONTROLS UNIT A5 .............................................. 5.5-1 5.5.1 Description ......................................................................................................5.5-1 5.5.2 Unit Lay-outs....................................................................................................5.5-2 5.5.3 Circiuit diagram................................................................................................5.5-3 5.5.4 Parts list ..........................................................................................................5.5-4 5.6 POWER SUPPLY A6................................................... 5.6-1 5.6.1 Description A6................................................. 5.6-1 5.6.2 Signal name list A6............................................. 5.6-5 5.6.3 Unit lay-outs .................................................. 5.6-7 5.6.4 Circuit diagram ................................................ 5.6-9 5.6.5 Parts list .................................................... 5.6-13 5.7 RESERVED FOR FUTURE EXTENSIONS.................................. 5.7-1 5.8 DIGITIZER A8 ........................................................ 5.8-1 5.8.1 Descriptions .................................................. 5.8-1 5.8.2 Signal name list digitizer A8 ..................................... 5.8-23 5.8.3 Unit lay-outs ................................................. 5.8-29 5.8.4 Location list.................................................. 5.8-31 5.8.5 Circuit diagrams .............................................. 5.8-37 5.8.6 Parst list .................................................... 5.8-55 5.9 RESERVED FOR FUTURE EXTENSIONS.................................. 5.9-1 5.10 CONNECTOR BOARD A10............................................. 5.10-1 5.10.1 Unit lay-out .................................................. 5.10-1 5.10.2 Circuit diagram ............................................... 5.10-3 5.10.3 Parts list .................................................... 5.10-5 5.11 FACTORY INSTALLED OPTIONS................................................................................5.11-1 5.11.1 IEEE-OPTION................................................................................................5.11-1 5.11.2 AUXILIARY OUTPUTS OPTION....................................................................5.11-1 5.11.3 EXTERNAL TRIGGER OPTION....................................................................5.11-7 6 PERFORMANCE TEST....................................................6 1 6.1 GENERAL INFORMATION ................................................6-1 6.2 RECOMMENDED TEST EQUIPMENT .......................................6-2 6.3 TEST PROCEDURE .....................................................6-3 6.3.1 Preliminary settings...............................................6-3 6.3.2 Power supply....................................................6-3 6.3.3 Auto set........................................................6-4 6.3.4 Orthogonality....................................................6-5 6.3.5 Trace distortion ..................................................6-6 6.3.6 Vertical deflection; deflection coefficients..............................6-6 6.3.7 Vertical deflection; variable gain control range (continuation of 4.3.6) ........6-8 6.3.8 Vertical deflection; input coupling (continuation of 4.3.7) ..................6-8 6.3.9 Vertical cursor accuracy (continuation of 4.3.8.).........................6-9 6.3.10 Vertical deflection; high-frequency response ...........................6-9 6.3.11 Vertical deflection; low-frequency response ...........................6-10 6.3.12 Vertical deflection; dynamic range at 15/25/50 MHz.....................6-11 6.3.13 Vertical deflection; dynamic range at 60/100/200 MHz (continuation of 4.3.12) 6-11 6.3.14 Vertical deflection; position range...................................6-12 6.3.15 Vertical deflection; crosstalk between channels at 60/100/200 MHz ........6-12 6.3.16 Vertical deflection; common mode rejection ratio at 1 MHz ...............6-13 6.3.17 Vertical deflection; common mode rejection ratio at 50 MHz (continuation of 4.3.16)...........................................6-14 6.3.18 Vertical deflection; LF linearity .....................................6-15 6.3.19 Vertical deflection; visual signal delay................................6-15 6.3.20 Vertical deflection; base line instability...............................6-17 6.3.21 Delay difference between vertical channels ...........................6-17 6.3.22 Horizontal deflection; display modes and trace separation................6-19 6.3.23 Horizontal deflection; X deflection...................................6-20 6.3.24 Horizontal deflection; MAIN TB deflection coefficients ...................6-21 6.3.25 Horizontal deflection; VARiable mode accuracy MAIN TB.................6-22 6.3.26 Time cursor accuracy (continuation of 4.3.25) .........................6-23 6.3.27 Horizontal deflection; DELAYED TIME BASE deflection coefficients........6-24 6.3.28 Horizontal deflection; delay time multiplier ............................6-25 6.3.29 Horizontal deflection; delayed timebase jitter ..........................6-26 6.3.30 Horizontal deflection; X deflection coefficient via CH1 ...................6-26 6.3.31 Horizontal deflection; X deflection coefficient via ’line’ ...................6-27 6.3.32 Horizontal deflection; high frequency response ........................6-28 6.3.33 Maximum phase shift between horizontal and vertical deflection...........6-28 6.3.34 MAIN TB triggering PM3390A/3392A/3394A; trigger sensitivity via CH1, CH2, CH3 and CH4 (EXT) ...................6-30 6.3.35 MAIN TB triggering PM3370A/3380A/3382A/3384A; trigger sensitivity via CH1, CH2, CH3 and CH4 (EXT)....................6-31 6.3.36 MAIN TB/DEL’D TB triggering; trigger sensitivity TVL-TVF ...............6-32 6.3.37 DEL’D TB triggering PM3390A/92A/94A; trigger sensitivity via CH1, CH2, CH3 and CH4 (EXT) ...................6-32 6.3.38 DEL’D TB triggering PM3370A/80A/82A/84A; trigger sensitivity via CH1, CH2, CH3 and CH4 (EXT)....................6-34 6.3.39 Trigger sensitivity in logic mode PM3392A/3394A ......................6-35 6.3.40 Trigger sensitivity in logic mode PM3382A/3384A ......................6-36 6.3.41 Z-MOD sensitivity ...............................................6-37 6.3.42 Probe Adjust signal; frequency and output voltage......................6-38 6.3.43 Auto range functions.............................................6-39 7 CALIBRATION ADJUSTMENT PROCEDURE...........................7-1 7.1 INTRODUCTION ........................................................7-1 7.2 DARK LEVEL OF CRT....................................................7-1 7.3 TRACE ROTATION.......................................................7-2 7.4 HORIZONTAL (X) GAIN AND OFFSET (CRT)..................................7-2 7.5 TEXT STABILITY AND X-OFFSET (CRT).....................................7-2 7.6 VERTICAL (Y) GAIN AND OFFSET (CRT).....................................7-2 7.7 HORIZONTAL GAIN AND OFFSET (VECTOR).................................7-3 7.8 VERTICAL GAIN AND OFFSET (VECTOR) ...................................7-3 7.9 ASTIGMATISM..........................................................7-3 7.10 AUTOCAL PROCEDURE..................................................7-3 7.11 LF SQUARE-WAVE RESPONSE CH1........................................7-4 7.12 LF SQUARE-WAVE RESPONSE CH2 .......................................7-5 7.13 LF SQUARE-WAVE RESPONSE CH3 .......................................7-5 7.14 LF SQUARE-WAVE RESPONSE CH4 and EXT TRIG ...........................7-6 7.15 HF SQUARE-WAVE RESPONSE FINAL Y AMPLIFIER..........................7-7 7.16 HF RESPONSE DSO MODE...............................................7-8 7.17 TRIGGER DELAY ADJUSTMENT...........................................7-9 7.18 SAVING THE CALIBRATION DATA.........................................7-10 7.19 TESTING THE INSTRUMENT’S PERFORMANCE.............................7-10 8 CORRECTIVE MAINTENANCE PROCEDURES 8 1 8.1 DISMANTLING THE INSTRUMENT .........................................8-1 8.1.1 General information...............................................8-1 8.1.2 Removing the cabinet and carrying handle.............................8-1 8.2 REPLACEMENTS .......................................................8-1 8.2.1 Standard parts...................................................8-2 8.2.2 Special parts....................................................8-2 8.2.3 Transistors and Integrated Circuits...................................8-2 8.3 STATIC SENSITIVE COMPONENTS ........................................8-2 8.4 SOLDERING TECHNIQUES ...............................................8-3 8.4.1 General soldering techniques.......................................8-3 8.4.2 Soldering micro-miniature semi-conductors ............................8-3 8.5 REMOVING THE UNITS, MECHANICAL PARTS AND CRT ......................8-4 8.5.1 Removing the rotary knobs.........................................8-4 8.5.2 Detachment of ribbon cables........................................8-4 8.5.3 Removal of signal unit A1 ..........................................8-5 8.5.4 Removal of Final XYZ amplifier unit A2................................8-6 8.5.5 Removal of unit at socket of CRT....................................8-7 8.5.6 Removal of Cathode Ray Tube (CRT) ................................8-7 8.5.7 Removal of microprocessor unit A3 ..................................8-7 8.5.8 Removal of the units in the front frame (A4, A5).........................8-8 8.5.9 Removal of the Power supply unit A6.................................8-8 8.5.10 Removal of digitizer unit A8.........................................8-9 8.6 INSTRUMENT REPACKING ...............................................8-9 8.7 TROUBLESHOOTING TECHNIQUES........................................8-9 8.8 TROUBLESHOOTING THE POWER SUPPLY................................8-10 8.9 SPECIAL TOOLS.......................................................8-11 8.9.1 Extension board ................................................8-11 8.9.2 Flash-ROM loader program........................................8-11 8.10 RECALIBRATION AFTER REPAIR.........................................8-11 8.11 TESTS BUILT INTO THE INSTRUMENT.....................................8-12 8.11.1 Power-up test...................................................8-12 8.11.2 Introduction to diagnostic tests......................................8-12 8.11.3 SELFTESTS....................................................8-15 8.11.4 Repair tools....................................................8-17 9 SAFETY INSPECTION AND TESTS AFTER REPAIR AND MAINTENANCE IN THE PRIMARY CIRCUIT.............................9-1 9.1 GENERAL DIRECTIONS..................................................9-1 9.2 SAFETY COMPONENTS..................................................9-1 9.3 CHECKING PROTECTIVE GROUND........................................9-1 9.4 CHECKING INSULATION RESISTANCE .....................................9-1 9.5 CHECKING LEAKAGE CURRENT ..........................................9-1 9.6 VOLTAGE TEST ........................................................9-1