Keithley 7071 Plug-In
Manufacturer:
Model:
7071
Date:
1991
Category:
Group:
Description:
General Purpose Matrix Card

Information

The Model 7071 is a general purpose, three-pole 8 x 12 (8 row by 12 column) matrix card. Some of the key features include: • Guard capability. Each HI/LO path pair on the PC board is surrounded by a third path that can be used for guarding. • Low contact potential and offset current for minimal effects on low-level signals. • Quick disconnects using the "rack and panel" receptacles on the rear panel or terminal blocks on the PC board.

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Service and User Manual
Manual type:
Service and User Manual
Pages:
79
Size:
2.94 Mbytes (3081946 Bytes)
Language:
english
Revision:
D
Manual ID:
7071-901-01
Date:
1991 06 01
Quality:
Scanned document, all readable.
Upload date:
2018 08 25
MD5:
9c3471e1b79186c3d4b73b039157c8ef
Downloads:
452

Information

1.1 INTRODUCTION ... 1-1 1.2 FEATURES ... 1-1 1.3 WARRANTY INFORMATION ... 1-1 1.4 MANUAL ADDENDA ... 1-1 1.5 SAFETY SYMBOLS AND TERMS ... 1-1 1.6 SPECIFICATION S ... 1-1 1.7 UNPACKING and INSPECTION ... 1-1 1.7.1 Inspection for Damage ... 1-1 1.7.2 Shipping Contents ... 1-2 1.7.3 Instruction Manual ... 1-2 1.8 REPACKING FOR SHIPMENT ... 1-2 1.9 OPTIONAL ACCESSORIES ... 1-2 SECTION 2—Operation 2.1 INTRODUCTION ... 2-1 2.2 HANDLING PRECAUTIONS ... 2-1 2.3 CARD INSTALLATION AND REMOVAL ... 2-1 2.4 BASIC MATRIX CONFIGURATIONS ... 2-2 2.4.1 Single-Ended Switching ... 2-6 2.4.2 Differential Switching ... 2-6 2.4.3 Guarding ... 2-6 2.4.4 Sensing ... 2-6 2.5 CONNECTION METHODS ... 2-8 2.5.1 Connection Methods Using Mass Terminated Cable (Model 7078-MTC) ... 2-9 2.5.2 Direct Connection Method ... 2-15 2.5.3 Connection Method Using Connector Kit {Model 7078-KIT) ... 2-15 2.6 MATRIX EXPANSION ... 2-18 2.6.1 Narrow Matrix Expansion ... 2-18 2.6.2 Wide Matrix Expansion ... 2-19 2.6.3 Partial Matrix Implementation ... 2-20 2.6.4 Mainframe Matrix Expansion ... 2-20 2.7 TYPICAL CONNECTION SCHEMES ... 2-21 2.7.1 Single Card System ... 2-21 2.7.2 Multiple Card System ... 2-22 2.7.3 Multiple Mainframe System ... 2-22 SECTION 3—Applications 3.1 INTRODUCTION ... 3-1 3.2 THICK FILM RESISTOR NETWORK TESTING ... 3-1 3.2.1 Four-terminal Ohms Measurements ... 3-2 3.2.2 Voltage Divider Checks ... 3-3 3.2.3 Current Shunt Checks ... 3-5 3.3 TRANSISTOR TESTING ... 3-5 3.3.1 Current Gain Checks ... 3-7 4.1 INTRODUCTION ... 4-1 4.2 HANDLING AND CLEANING PRECAUTIONS ... 4-1 4.3 RELAY TEST PROGRAM SETUP ... 4-1 4.4 PERFORMANCE VERIFICATION ... 4-2 4.4.1 Environmental Conditions ... 4-3 4.4.2 Recommended Equipment ... 4-3 4.4.3 Path Resistance Tests ... 4-3 4.4.4 Offset Current Tests ... 4-5 4.4.5 Contact Potential Tests ... 4-7 4.4.6 Path Isolation Tests ... 4-9 4.4.7 Differential and Common Mode Isolation Tests ... 4-11 4.5 PRINCIPLES OF OPERATION ... 4-13 4.5.1 Card Identification ... 4-13 4.5.2 Switching Circuitry ... 4-14 4.5.3 Power Up Safeguard ... 4-14 4.6 SPECIAL HANDLING OF STATIC-SENSITIVE DEVICES ... 4-14 4.7 TROUBLESHOOTING ... 4-15 4.7.1 Recommended Equipment ... 4*15 4.7.2 Troubleshooting Procedure ... 4-15 SECTION 5—Replaceable Parts 5.1 INTRODUCTION ... 5-1 5.2 PARTS LISTS ... ; ... 5-1 5.3 ORDERING INFORMATION ... 5-1 5.4 FACTORY SERVICE ... 5-1 5.5 COMPONENT LAYOUT AND SCHEMATIC DIAGRAM ... 5-1

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