Geräte Informationen:

Racal 9087 Generator
Hersteller:
Racal
Modell: 9087
Datum: 1984
Kategorie: Messgeräte
Gruppe: Generator
Beschreibung: SYNTHESIZED SIGNAL GENERATOR
Informationen:
                                    2.1 INTRODUCTION
2.1.1 The Racal-Dana signal generator Model 9087 is designed
primarily for the testing of communication equipment over
the frequency range from 10 kHz to 1.3 GHz. The RF output is
phase-locked to the frequency standard, the wide frequency
range being obtained by the use of a multi loop synthesizer.
The instrument is microprocessor controlled, and combines
versatility with ease-of-control.
2.2 RF TUNING
2.2.1 Tuning may be effected in one of five ways. These are:
(a) Numeric keyboard. The required frequency is set directly.
(b) Step-up and step-down keys. The displayed frequency is
changed in steps. The step size may be one of three preset
values, or an operator-set value.
(c) Spinwheel. The displayed frequency changes in steps as
the spinwheel is rotated. Again, the step size may be one of
three preset values or an operator-set value. The use of the
spinwheel, particularly with a small step size, affords all
the advantages of analog tuning while retaining the
stability of a synthesized system. A HOLD control is
provided to isolate the spinwheel to prevent accidental
changing of the frequency set.
(d) GPIB. An internal interface is fitted.
(e) Direct frequency access (DFA). The required frequency
may be set by applying suitable control signals directly to
the microprocessor data bus to a rear-panel socket. The use
of this method permits extremely rapid changes of frequency
to be made. A special interface is required. Full details
may be obtained from Racal-Dana Instruments.
2.2.2. The frequency set is displayed on a 10-digit,
dot-matrix LED display, affording 1-Hz resolution throughout
the frequency range of the instrument. The decimal point is
fixed, and leading zeros are suppressed.
2.3 FREQUENCY SWEEP
2.3.1 The 9087 incorporates a frequency-sweep facility which
permits the output frequency to be swept, in steps, between
two operator-selectable frequencies. The step size can be
selected by the operator, and four preset step rates are
available.
2.4 RF OUTPUT
2.4.1 Automatic levelling maintains the output level within
±0.4 dB for output frequencies up to 650 MHz, and within
±1.0 dB for output frequencies in the range from 650 MHz to
1.3 GHz, relative to the 50 MHz level.
2.4.2 The output-level range is from +19 dBm to -140 dBm
into 50 Ω. The level may be set by means of a numeric
keyboard, or the set value may be stepped up or down using
either the step keys or the spinwheel. The step size may be
one of three preset values, or an operator-set value.
2.5 MODULATION FACILITIES
2.5.1 Amplitude, pulse, frequency, and phase modulation
facilities are provided. Two internal-modulating
frequencies, locked to the frequency standard, are provided,
and external-modulating sources may also be used. Details of
the permissible range of modulating frequencies, and of the
modulation depths and peak deviations which can be obtained,
are to be found in Section 1 of this manual.
2.5.2 Amplitude or pulse modulation may be applied
simultaneously with frequency or phase modulation. Either or
both of the internal-modulating sources, or a combination of
internal and external sources may be used.
2.6 FR0NT-PANEL SETTING STORAGE
2.6.1 A non-volatile memory allows the storage of up to 33
(100, if the 100- location memory option is fitted) complete
sets of front-panel control settings. These may then be
recalled when required. The recalled data may be implemented
immediately, or may be displayed for checking before the
instrument output is reset. This facility allows the
contents of the store to be examined without affecting the
output of the instrument.
2.6.2 An exchange facility allows the contents of any two
store locations to be exchanged without affecting the output
of the instrument.
2.6.3 On switching off, the current front-panel control
settings are stored automatically. On switching on again,
these settings are immediately implemented. An
initialization program is also provided to set the
instrument to a known state.
2.7 ERROR INDICATIONS
2.7.1 Certain errors in the operation of the instrument will
result in the flashing of a LED-error indicator and the
generation of a service request (SRQ) via the GPIB
interface. The errors which can be detected are each given a
two-digit code, which can be displayed. The nature of the
error can then be established by reference to the pull-out
information card beneath the instrument or to Section 4 of
this manual.
2.8 DIAGNOSTIC CHECKS
2.8.1 Several points in the instrument's circuits are
monitored for possible malfunction. The detection of a fault
is indicated by the generation of an error indication. A
digit in the numeric displays will flash to indicate the
location of the fault.
2.8.2 In the event of overheating, the instrument is
switched automatically to the standby condition, with only
the frequency standard and the microprocessor system active.
2.9 SPECIAL FUNCTIONS
2.9.1 A number of special functions are available to the
operator. Details are given in Section 4 of this manual.
2.10 OUTPUT PROTECTION
2.10.1 The RF output will withstand the accidental
application of reverse-RF power at levels up to 1 W.
2.10.2 Protection against reverse powers of up to 50 W is
given by the internally mounted,
reverse-power-protection-unit option. This isolates the RF
output socket, and sounds an audible alarm, when reverse
powers are applied above the threshold level. The device
latches in the tripped state.
2.11 GPIB INTERFACE
2.11.1 An internally mounted interface to the IEEE-488-GPIB
is provided. This enables all the instrument functions,
except the line power switching and frequency standard
changeover, to be remotely controlled. An adapter to provide
compatibility with the IEC 625-1 bus is available as an
optional accessory.
2.11.2 Control via the GPIB may be exercised in one of three
ways. These are:
(a) Immediate Mode Control, in which each data byte accepted
by the 9087 from the bus is processed before the next byte
is accepted. This provides the shortest delay in completing
the resetting of the 9087's output following a data entry
made on a controller keyboard.
(b) Deferred Mode Control, in which the complete data string
is accepted from the bus and stored before processing is
commenced. The use of the bus is therefore limited to the
data transfer time, and better utilization of the bus is
possible at the cost of a small increase in the total time
taken to vary the 9087's output parameters.
(c) Learn Mode Control, in which data strings related to
particular settings of the 9087's output are generated in
the 9087 and stored in an external memory. When a data
string is fed back to the 9087 as an addressed command, the
output parameters will be set to the related values. This
provides a significant saving in time when compared with
keyboard control, and, by feeding back a succession of data
strings, the 9087 may be stepped rapidly through a number of
different output-parameter patterns. Two lengths of data
string are available, the longer controlling the full range
of output parameters and the other controlling frequency
only. The longer data string may also be used to monitor the
instrument's settings. This may be found useful when the
9087 is used in operator-interactive systems.

Folgende Anleitungen sind für obiges Gerät verfügbar:

Racal -- 9087 -- Service- und Bedienungsanleitung
Dateiname: Racal-7300-Manual-Page-1-Picture
Dokumenttyp: Service- und Bedienungsanleitung
Seitenanzahl: 342
Dateigröße: 48.48 Mbytes (50833475 Bytes)
Sprache: Englisch
Revision:
Dokument-ID/Nummer: ΤΗ 3635
Datum: 1984
Qualität: Gescanntes Dokument, alles ist lesbar.
Upload Datum:
MD5: 1bad6f668011d34df91719a3ff0b6543
ed2kID: 44dfd3144a760d70b0184680a06ae23c
Downloads: 29 seit 25 Oktober 2015
Informationen:
1 TECHNICAL SPECIFICATION .........................1-1
2 GENERAL DESCRIPTION ..............................2-1
2.1 Introduction ......................................2-1
2.2 RF Tuning ......................................2-1
2.3 Frequency Sweep ..................................2-1
2.4 RF Output ......................................2-1
2.5 Modulation Facilities .........................2-2
2.6 Front Panel Setting Storage .....................2-2
2.7 Error Indications .............................2-2
2.8 Diagnostic Checks .............................2-2
2.9 Special Functions .............................2-3
2.10 Output Protection .............................2-3
2.11 GPIB Interface ..................................2-3
2.12 External Step Switches .........................2-4
2.13 Maintenance ......................................2-4
3 PREPARATION FOR USE ..............................3-1
3.1 Packaging ......................................3-1
3.2 Power Supply ............................... ... 3-1
3.2.1 AC Voltage Range Setting .....................3-1
3.2.2 Line Fuse ......................................3-1
3.2.3 DC Fuses ......................................3-2
3.2.4 Power Cord ......................................3-2
3.3 Frequency Standard ..............................3-2
3.4 External Step Switches .........................3-2
3.5 Battery Charging ..................................3-3
3.6 Operator's Checks ..................................3-3
3.7 Fitting the Fixed Rack Mounting Kit 11-1576 ... 3-11
4 OPERATING INSTRUCTIONS .........................4-1
4.1 Introduction ......................................4-1
4.2 Description of Controls, Indicators and Connectors 4-1
4.2.2 Front Panel Items ..............................4-1
4.2.3 Rear Panel Items ..............................4-5
4.3 Switching On ......................................4-9
4.4 Simplified Operating Procedure .................4-9
4.5 Operating Instructions .........................4-9
4.5.2 Frequency ......................................4-11
4.5.3 Frequency, Relative .........................4-13
4.5.4 Frequency, Sweep ..............................4-15
4.5.5 Amplitude ......................................4-17
4.5.6 Amplitude, Relative .........................4-19
4.5.7 Modulation, Amplitude .........................4-22
4.5.8 Modulation, Pulse ..............................4-25
4.5.9 Modulation, Frequency .........................4-27
4.5.10 Modulation, Phase .............................4-30
4.5.11 Modulation, Mixed ..............................4-33
4.5.12 Modulation, External Source .....................4-34
4.5.13 Increment .......................................4-35
4.5.14 Step Size, Operator-Set ..........................4-39
4.5.15 Initialisation ..................................4-41
4.5.16 Memory, Store ..................................4-42
4.5.17 Memory, Recall (Normal) .........................4-44
4.5.18 Memory, Recall (Immediate) .....................4-46
4.5.19 Memory, Exchange ..............................4-48
4.5.20 Standby ...4-50
4.5.21 Special Functions .............................4-51
4.5.22 Error Codes ...4-54
4.5.23 Reverse Power Protection Unit .................4-57
5 OPERATION VIA THE GPIB ..............5-1
5.1 Preparation For Use With the GPIB.................5-1
5.1.1 Introduction ..................................5-1
5.1.2 Connections to the GPIB.........................5-1
5.1.3 Address Setting..................................5-1
5.2 Data Acceptance Modes.............................5-3
5.3 Display Updating ..................................5-4
5.4 Data Output ......................................5-4
5.5 The Instrument Status Data String.................5-5
5.6 The Learn Mode ..................................5-6
5.6.1 Introduction ..................................5-6
5.6.2 Obtaining a Data String Output .................5-7
5.7 Monitoring the Control Settings .................5-8
5.8 SRQ and Status Byte Outputs .....................5-12
5.8.1 Status Byte Format ..............................5-12
5.8.2 Status Byte Mask Register .....................5-12
5.8.3 Setting the Mask Register .....................5-12
5.8.4 Reading the Mask Register .....................5-13
5.9 Remote/Local Changeover .........................5-13
5.9.1 Local to Remote Changeover .....................5-13
5.9.2 Remote to Local Changeover .....................5-13
5.9.3 Local Lockout (LLO) ...........................5-13
5.10 Logic Levels ......................................5-14
5.11 GPIB Command ......................................5-14
5.11.2 Immediate and Deferred Data Acceptance Modes 5-14
5.11.3 The Fast Learn Mode..............................5-16
5.11.4 The Long Learn Mode..............................5-17
5.12 Operating Instructions for Remote Control .........5-17
5.12.1 Operating Modes ..................................5-17
5.12.2 Command Codes for Remote Control .............5-17
6 PRINCIPLES OF OPERATION .............6-1
6.1 Introduction ......................................6-1
6.2 Physical Contruction ..............................6-1
6.3 Servicing the Sealed Modules .....................6-1
6.4 Principles of Operation .........................6-1
6.4.1 Functional Systems ..............................6-1
6.4.2 The RF Generating System .....................6-1
6.4.3 The Control, Memory and Display System .........6-2
6.4.4 The Power Supply System.........................6-6
6.5 Technical Description ...6-6
6.5.1 The RF Generating System .....................6-6
6.5.2 The Audio System Assembly .....................6-6
6.5.2.1 Introduction ..................................6-6
6.5.2.2 The FM/0M Channel ...........................6-6
6.5.2.3 The AM/Pulse Moduation Channel .............6-12
6.5.2.4 The Control Channel .........................6-15
6.5.3 The Control, Memory and Display System .........6-16
6.5.4 The Processor Assembly .........................6-16
6.5.4.1 Introduction ..................................6-16
6.5.4.2 The Bus Structure..............................6-16
6.5.4.3 Control Line Decoding .........................6-17
6.5.4.4 The System Clocks ..............................6-18
6.5.4.5 Addressing the Program ROM .................6-21
6.5.4.6 The Random Access Memory .....................6-22
6.5.4.7 Interrupt Operation .........................6-22
6.5.4.8 Keyboard Operation .........................6-23
6.5.4.9 Spinwheel Operation .........................6-23
6.5.4.10 Reset Circuit ..................................6-24
6.5.4.11 Test Switch ..................................6-24
6.5.5 The Non-Volatile Memory Assembly .............6-24
6.5.5.1 Introduction ..................................6-24
6.5.5.2 Memory Addressing..............................6-25
6.5.5.3 Read/Write Control .........................6-25
6.5.5.4 Memory Supply Changeover .....................6-25
6.5.5.4 The Battery Charging System .................6-25
6.5.6 The Display System .............................6-26
6.5.6.1 Introduction ..................................6-26
6.5.6.2 Display Element Addressing .................6-26
6.5.6.3 LED Flashing Circuit .........................6-26
6.5.6.4 Display Check and Inhibit .....................6-27
6.5.6.5 Spinwheel Pulse Generator.....................6-28
6.5.7 LF Synthesizer, Attenuator and RPPU Control ... 6-28
6.5.7.1 Introduction ..................................6-28
6.5.7.2 Control Line Decoding .........................6-28
6.5.7.3 LF Control Line Setting .....................6-28
6.5.7.4 Output Attenuator Control Line Setting ... 6-29
6.5.7.5 RPPU Operation ..............................6-30
6.5.7.6 Output Amplifier Bandwidth Control .........6-30
6.5.7.7 Clunker Drive ..................................6-30
6.5.7.8 Auxiliary Input Operation .......................6-30
6.5.7.9 Alarm Test ..................................6-31
5.5.8 The GPIB Interface ..............................6-31
6.5.8.1 Introduction ..................................6-31
6.5.8.2 Address Setting and Recognition .............6-31
6.5.8.3 Operation as a Listener .....................6-31
6.5.8.4 Operation as a Talker.........................6-32
6.5.8.5 Detection of the Serial Poll Disable Message 6-33
6.5.8.6 Untalk, Unlisten and IFC Interrupt .........6-33
6.5.8.7 ATN Interrupt ..................................6-33
6.5.9 The Audio System Assembly .....................6-33
6.5.10 The FM System Assembly .........................6-33
6.5.11 The Output System Assembly .....................6-33
6.5.12 The Comb Loop Assembly .........................6-34
6.5.12.1 Introduction ..................................6-34
6.5.12.2 Decoder and Data Latches .....................6-34
6.5.12.3 Directly Controlled Lines .....................6-34
6.5.12.4 Control Line 0CB2..............................6-34
6.5.12.5 Control Lines OCB0 and 0CB1...................6-34
6.5.12.6 ROM Controlled Lines .........................6-35
6.5.13 The Power Supply System .........................6-35
6.5.13.1 Introduction ..................................6-35
6.5.13.2 The +5 V (A) Supply .........................6-35
6.5.13.3 The +18 V Supply ..............................6-36
6.5.13.4 The Overtemperature Interrupt .................6-37
6.5.13.5 PWRDN Interrupt ..............................6-38
7 MAINTENANCE ...7-1
7.1 Introduction ......................................7-1
7.2 Test Equipment Required ... ......................7-1
7.3 Automatic Indications of Fault Conditions .........7-1
7.3.1 Introduction ..................................7-1
7.3.2 The Processor RAM Check.........................7-4
7.3.3 The Program ROM Check .........................7-4
7.3.4 Stuck Key Check..................................7-5
7.3.5 Non-Volatile Memory Check .....................7-5
7.3.6 Out of Lock Errors ..............................7-5
7.3.7 Power Supply Failures .........................7-7
7.4 Special Functions for Fault Diagnosis .......7-7
7.4.1 Introduction ..................................7-7
7.4.2 Special Functions 11, 12 and 13.................7-8
7.4.3 Special Functions 24, 25 and 26.................7-9
7.4.4 Special Function 27..............................7-10
7.4.5 Special Functions 30, 32 and 33..................7-10
7.4.6 Special Function 34...............................7-11
7.4.7 Special Function 35..............................7-11
7.4.8 Special Function 36..............................7-11
7.4.9 Special Function 37..............................7-11
7.4.10 Special Function 52 ........................... 7-12
7.4.11 Special Function 75 ........................... 7-13
7.4.12 Special Function 90 ........................... 7-13
7.4.13 Special Function 91 and 92 ................... 7-13
7.4.14 Special Function 98 ........................... 7-13
7.5 Signature Analysis ........................... 7-14
7.5.1 Test Equipment ............................... 7-14
7.5.2 Preparation for Signature Analysis .......... 7-14
7.5.3 Connecting the Signature Analyzer .......... 7-14
7.5.4 Analysis Procedure ........................... 7-15
7.6 Fault Location ............................... 7-21
7.7 Setting Up After Repair ....................... 7-21
7.7.1 Introduction .............................. 7-21
7.7.2 Display Assembly 19-1041 .................. 7-21
7.7.3 Non-Volatile Memory Assembly 19-1049 ...... 7-21
7.7.3.2 Preparation for Testing ................... 7-21
7.7.3.3 VALID POWER Signal Test .................. 7-22
7.7.3.4 Battery Voltage Threshold Setting .......... 7-22
7.7.3.5 Battery Charging Time Test .............. 7-22
7.7.3.6 Option Check ............................... 7-35
7.7.3.7 Memory Corruption Check ................... 7-35
7.7.4 Processor Assembly 19-1051 ................... 7-35
7.7.4.2 Preparation for Testing ................... 7-35
7.7.4.3 Clock Timing Adjustment ................... 7-35
7.7.4.4 NMI Test ................................... 7-36
7.7.4.5 Spinwheel Counter Test ................... 7-36
7.7.4.6 Standby Test ............................... 7-37
7.7.5 Motherboard Assembly 19-1043 .............. 7-37
7.7.5.2 Preparation for Testing ................... 7-37
7.7.5.3 Out-of-Lock Lines Test ................... 7-37
7.7.5.4 Spinwheel Test ........................... 7-37
7.7.5.5 Keyboard Test............................... 7-37
7.7.5.6 Setting the Monostable Timing .............. 7-38
7.7.5.7 Attenuator Drive Test ....................... 7-38
7.7.5.8 Output Amplifier Control Test .............. 7-38
7.7.5.9 RPPU Circuit Test........................... 7-38
7.7.5.10 LF Synthesizer Drive ....................... 7-39
7.7.5.11 Standby Test ............................... 7-39
7.7.5.12 GPIB and Memory Board Test .............. 7-39
7.7.6 FM Module 11-1535 ........................... 7-41
7.7.7 Audio system Assembly 19-1048 .............. 7-41
7.7.7.2 Preparation for Testing .................. 7-41
7.7.7.3 FM/0M Channel ....................... ... 7-41
7.7.7.4 AM/Pulse Channel ........................... 7-43
7.8 Dismantling and Reassembly .................. 7-45
7.8.1 Introduction ............................... 7-45
7.8.1.1 Semi-Rigid Coaxial Connectors .............. 7-45
7.8.1.2 Ribbon Cable Connectors .................. 7-46
7.8.1.3 Assembly Location ........................... 7-46
7.8.2 Removing the Covers..............................7-46
7.8.3 Assemblies 19-1049, 19-1050 and 19-1051 .........7-46
7.8.4 Removing the Module Block ......................7-47
7.8.5 Dismantling the Module Block .................7-47
7.8.5.1 Introduction ..................................7-47
7.8.5.2 Audio System Assembly 19-1048 .................7-48
7.8.5.3 Output System Module 11-1532 .................7-48
7.8.5.4 Comb Loop Module 11-1702 ......................7-48
7.8.5.5 Reference Generator and LF Synthesizer Module
11-1534 ......................................7-48
7.8.6 Power Supply Control Assembly 19-1059 .........7-49
7.8.7 Power Supply Interconnect Assembly 19-1058 ... 7-49
7.8.8 GPIB Connector Assembly 19-1053 .................7-49
7.8.9 Rear Panel Assembly...............................7-50
7.8.10 Power Supply Chassis Assembly .................7-50
7.8.11 Frequency Standard and Assembly 19-1167 .........7-51
7.8.12 Attenuator Assembly 11-1526 ......................7-51
7.8.13 Front Panel Assembly ..........................7-51
7.8.14 Display Assembly 19-1041 ......................7-52
7.8.15 Motherboard Assembly 19-1043 .................7-52
7.9 Overall Specification Check ......................7-53
7.9.1 Introduction ..................................7-53
7.9.2 Preferred PVPs ..................................7-53
7.9.2.1 Frequency PVP ..................................7-53
7.9.2.2 Output Level Accuracy and Flatness PVP ... 7-54
7.9.2.3 Attenuator PVP..................................7-55
7.9.2.4 Audio Output PVP ..............................7-56
7.9.2.5 Modulation PVPs ..............................7-58
7.9.2.6 SSB Phase Noise PVP (Optional) .............7-61
7.9.2.7 Broadband Noise Floor PVP (Optional) .........7-62
7.9.2.8 Spectral Purity PVP ..........................7-62
7.9.2.9 Internal Frequency Standard PVP .............7-64
7.9.2.10 External Standard Input PVP .................7-65
7.9.3 Alternative PVPs ..............................7-65
7.9.3.1 Output Level Accuracy and Flatness PVP ... 7-65
7.9.3.2 Attenuator PVP ..............................7-66
7.9.3.3 Audio Output PVP ..............................7-66
7.9.3.4 Internal Frequency Modulation PVP .............7-68
7.9.3.5 Broadband Noise Floor PVP (Optional) .........7-69
8 PARTS LIST, COMPONENT LAYOUTS AND CIRCUIT DIAGRAMS
Parts List: Chassis Assembly 11-1520 .............Parts List 1
Parts List: Front and Rear Panel Assemblies ... Parts List 3
Parts List: Display Assembly 19-1041 .............Parts List 5
Parts List: Motherboard Assembly 19-1043 .........Parts List 11
Parts List: Audio System Assembly 19-1048 .........Parts List 17
Parts List: Non-Volatile Memory Assembly 19-1049 Parts List 29
Parts List: GPIB Assembly 19-1050 ..................Parts
List 33
Parts List: Parts List: Parts List: Parts List:
Parts List: Parts List: Parts List: Parts List:
Parts List: Parts List:
Processor Assembly 19-1051 ......
GPIB Connector Assembly 19-1053
Power Supply System ..............
Oscillator Supply Filter Assembly
19-1167 ...........................
Output System Module 11-1532 ......
Comb Loop Module 11-1702 ..........
FM System Module 11-1535 ..........
Reference Generator and LF Synthesizer
Module 11-1534 ...................
Module Block Assembly ..............
Austron Oscillator Option 19-1158 ...
Chassis Layout ......
Module Block ..........
Display Assembly 19-1041:
Interconnections ......
Austron Oscillator Option
19-1158: Layout and
Component Layout
Circuit Diagram ......
Motherboard Assembly 19-1043: Component Layout
Circuit Diagram ......
Audio System Assembly 19-1048: Component Layout
Circuit Diagram ......
Non-Volatile Memory Assembly 19-1049:
Component Layout
Circuit Diagram ......
GPIB Assembly 19-1050: Component Layout
Circuit Diagram ......
Processor Assembly 19-1051: Component Layout
Circuit Diagram ......
GPIB Connector Assembly 19-1053: Component Layout
Circuit Diagram ......
Power Supply Chassis: Component Layout
Power Supply Interconnect Assembly: Component Layout
Power Supply Control Assembly: Component Layout
Power Supply: 'Circuit Diagram ......
Oscillator Supply Filter Assembly 19-1167:
Layout and Circuit Diagram Output System Module 11-1532:
Component Layout
Circuit Diagram .
Comb Loop Module 11-1702: Component Layout
Circuit Diagram .
FM System Module 11-1535: Component Layout
Circuit Diagram .
Reference Generator and LF Synthesizer Module 11-1534
Component Layout Circuit Diagram ..
Circuit Diagram
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3.1 Check Frequencies ..................................3-4
3.2 Check Frequencies ..................................3-4
5.1 GPIB Connector Pin Assignment......................5-1
5.2 Address Switch Setting ..........................5-2
5.3 Special Function Number Bit Allocation .........5-5
5.4 Special Function Number Bit Code .................5-6
5.5 Long Learn Mode Data String Interpretation ... 5-8
5.6 Numerical Data Format..............................5-9
5.7 Modulation Data .................................5-9
5.8 AM Control Data ..................................5-10
5.9 FM Control Data ..................................5-10
5.10 0M Control Data............. ....................5-10
5.11 Pulse Modulation Control Data ... ..................5-11
5.12 Incremental Control Data ..........................5-11
5.13 REL and Sign Data..................................5-11
5.14 Status Byte ......................................5-12
5.15 Character Acceptance Times ......................5-14
5.16 Processing Times ..................................5-15
5.17 Processing Plus Data Acceptance Times.............5-15
5.18 Bus Busy Times ..................................5-16
5.19 Frequency Commands ..............................5-18
5.20 Amplitude Commands ..............................5-18
5.21 Modulation Commands ..............................5-19
5.22 Memory Commands ..................................5-20
5.23 Data Acceptance Mode Codes ......................5-20
5.24 Data Output Mode Codes ..........................5-21
5.25 Status Byte Mask Setting Code......................5-21
5.26 Increment System Commands ..........................5-22
5.27 Miscellaneous Codes ..............................5-22
5.28 Alphabetic List of Function Codes.................5-23
5.29 Alphabetic List of Units Codes .................5-23
6.1 Logic Levels, FM/0M Modulation Source Selection 6-10
6.2 Modulation Enablement and Disablement, FM/0M 6-11
6.3 Logic Levels, AM/Pulse Modulation Selection ... 6-13
6.4 Modulation Enablement and Disablement, AM and
Pulse Modulation ..................................6-14
6.5 AUA Control Line Logic Levels......................6-15
6.6 System Control Lines ..............................6-17
6.7 Processor Assembly Local Control Lines .........6-18
6.8 Motherboard Assembly Local Control Lines .........6-29
6.9 Power Supply Rail Details ..........................6-35
7.1 Test Equipment Required ..........................7-1
7.2 Fault Indications ..................................7-4
7.3 Order of ROM Check ..............................7-5
7.4 Key Codes..........................................7-6
7.5 Out-of-Lock Indications ..........................7-6
7.6 Power Supply Failure Indications .................7-7
7.7 Special functions for Fault Diagnosis .............7-8
7.8 RF System Measurement Points .....................7-9
7.9 Signature Analysis, Assembly 19-1051 .......... 7-15
7.10 Signature Analysis, Module 11-1535 .......... 7-16
7.11 Signature Analysis, Assembly 19-1043 .......... 7-17
7.12 Signature Analysis, Assembly 19-1041 .......... 7-18
7.13 Signature Analysis, Assembly 19-1048 .......... 7-18
7.14 Signature Analysis, Assembly 19-1050 ... ....... 7-19
7.15 Signature Analysis, Module 11-1532 .......... 7-19
7.16 Signature Analysis, Assembly 19-1049 .......... 7-20
7.17 Keyboard Check ............................... 7-38
7.18 GPIB and Memory Board Test ................... 7-40
7.19 Frequency Verification ....................... 7-71
7.20 Output Level Accuracy Measurements .......... 7-72
7.21 Attenuator Verification ....................... 7-74
7.22 Audio Frequency Measurement ................... 7-74
7.23 Audio Output Level and Distortion .............. 7-74
7.24 Internal Frequency Modulation Verification ... 7-75
7.25 High/Low Detector Check ....................... 7-75
7.26 External Frequency Modulation Verification ... 7-75
7.27 Phase Modulation at 1 kHz Internal Modulation ... 7-76
7.28 Phase Modulation at 10 kHz External Modulation 7-76
7.29 Amplitude Modulation at 80% with 1 kHz INT
Modulation ................................... 7-76
7.30 Amplitude Modulation at 30% with 1 kHz INT
Modulation ................................... 7-77
7.31 External Amplitude Modulation at 80% .......... 7-77
7.32 Preliminary Pulse Modulation Verification ...... 7-77
7.33 Pulse Modulation Measurement ................... 7-78
7.34 Spurious Signal measurement ................... 7-78
7.35 Line-Related Spurious Signal Measurement ...... 7-78
7.36 Harmonic Frequency Measurement .............. 7-79
7.37 External Standard Input Signal Locking ...... 7-79
7.38 Attenuator Verification ....................... 7-80
7.39 Frequency Measurement for Audio Output Verification 7-80
7.40 Audio Output Level .......................... 7-80
7.41 Audio Output Distortion ....................... 7-81

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